Based on the previous successes, we are honored to welcome you to 2021 6th International Conference on Multimedia Systems and Signal Processing (ICMSSP 2021). It'll be held during May 22-24, 2021 in Shenzhen, China.

The aim of ICMSSP 2021 is to present the latest research and results of scientists related to Multimedia Systems and Signal Processing topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field.

2021年第六届多媒体系统和信号处理国际会议·将于2021年5月22-24日在中国·深圳召开,主题主要围绕多媒体和通信,多媒体信号处理,多媒体系统和应用等研究领域展开讨论,旨在为相关研究方向的专家学者及企业发展人提供一个分享研究成果、讨论存在的问题与挑战、探索前沿科技的国际性合作交流平台。 现热忱欢迎从事相关技术研究的专家、学者和专业技术人员踊跃投稿并参加大会。

Important notification! Due to recent coronavirus outbreak, we fully understand that some participants are now facing travel restrictions and may have to either cancel their participation. Therefore the option to do remote presentation is offered to encourage participants to continue with their presentations virtually by online conference, video conference (Zoom, etc.) Please note online presentation session will be arranged during the conference. We welcome your participation! (Read more). Subsequently, for a safer conference environment, the organizer will actively take protective measures such as, to remind every participant to wear the mask during the conference, take every participant's temperature before they enter and provide alcohol-based hand rub during the conference, etc.
重要通知:由于疫情原因, 部分作者由于新型冠状病毒疫情影响无法参会。因此除提供常规参会选项(口头以及海报报告)之外,本次会议将增设网络或视频报告的选择,并将在会议期间安排相应的分会场。由于疫情不能参会的人员,欢迎参加专门的网络分会。 同时,为了给参会人员提供一个更安全的参会环境,我们也会在会议现场积极采取保障措施,比如为参会人员提供免洗消毒液,参会人员进入会场之前进行体温检测等。

Call for papers / 会议征稿

ICMSSP 2021 welcomes submission of papers concerning any branch of the Multimedia Systems and Signal Processing, and their applications in other subjects. It includes Multimedia and Communications, Multimedia Signal Processing, and Multimedia Systems and Applications, and their applications. More topics,  

Conference Proceedings | 会议论文集收录

We provide a good opportunity by admiring your updated research knowledge and also by publishing it in the conference proceedings. The accepted paper will be published into the ICMSSP 2021 Conference Proceedings, which will be published in the International Conference Proceedings Series, and archived in the Online Digital Library. The proceedings will be submitted to be indexed by Ei Compendex and Scopus,  to be reviewed by Thomson Reuters Conference Proceedings Citation Index (ISI Web of Science)

会议收录的文章将以ICMSSP 2021 论文集形式出版, 并收录至在线数据库,被 EI Compendex 和 Scopus检索; 文章作者将被邀请参会展示研究报告,期待您的参与!

Online Submission System 在线投稿系统:

Please Check Here for More information

 
查看良好的论文集出版检索记录(Check)
ICMSSP 2020 Conference Proceedings | ISBN: 978-1-4503-7748-5 | ACM Digital library | EI COMPENDEX | SCOPUS
ICMSSP 2019 Conference Proceedings | ISBN: 978-1-4503-7171-1 | ACM Digital library | EI COMPENDEX | SCOPUS
ICMSSP 2018 Conference Proceedings | ISBN: 978-1-4503-6457-7 | ACM Digital library | EI COMPENDEX | SCOPUS
ICMSSP 2017 Conference Proceedings | ISBN: 978-1-4503-5314-4 | ACM Digital library | EI COMPENDEX | SCOPUS
ICMSSP 2016 Conference Proceedings | ISBN: 978-1-5090-4519-8 | Archived into IEEE Xplore

 
All full paper submissions will also be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. The full paper submissions will be chosen based on technical merit, interest, applicability, and how well they fit a coherent and balanced technical program. All full paper submissions will also be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. The full paper submissions will be chosen based on technical merit, interest, applicability, and how well they fit a coherent and balanced technical program.